CVE-2017-18157

Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20

Description A Use After Free Condition can occur in the Thermal Engine component of Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear. This issue may be related to memory management.

Recommendations For Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20, at the moment, there is no information about a newer version that contains a fix for this vulnerability.