PT-2023-24167

CVE-2023-33063

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Publicado

2023-10-03

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Atualizado

2024-06-17

Descrição por

CVSS 2.0
10
Alta
MétricasAV:N/AC:L/Au:N/C:C/I:C/A:C
Name of the Vulnerable Software and Affected Versions Qualcomm Multiple Chipsets (affected versions not specified)
Description The issue concerns memory corruption in DSP Services during a remote call from HLOS to DSP. No information is provided about the estimated number of potentially affected devices worldwide or real-world incidents where this issue was exploited.
Recommendations At the moment, there is no information about a newer version that contains a fix for this vulnerability.
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