PT-2019-8276

CVE-2017-18323

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Published

2019-01-03

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Updated

2019-01-10

Description by

CVSS 2.0
2.1
Low
MetricsAV:L/AC:L/Au:N/C:P/I:N/A:N
Name of the Vulnerable Software and Affected Versions Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.
Description A cryptographic key material leak was discovered in TDSCDMA RRC debug messages in Qualcomm Snapdragon automobile, mobile, and wear products. This issue may allow unauthorized access to sensitive information.
Recommendations For Qualcomm Snapdragon versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130, consider disabling TDSCDMA RRC debug messages to minimize the risk of exploitation until a patch is available. At the moment, there is no information about a newer version that contains a fix for this issue.
Exploitability
Fix
Vendors
Affected products
Weakness enumeration
Related identifiers
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